Development of wire bonding process
Seppänen, Tomi (2021)
2021
All rights reserved. This publication is copyrighted. You may download, display and print it for Your own personal use. Commercial use is prohibited.
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi:amk-2021121726730
https://urn.fi/URN:NBN:fi:amk-2021121726730
Tiivistelmä
The purpose of this thesis was to develop the wire bonding process by changing the design of the capillary used in it. The thesis was commissioned by Murata Electronics Oy. Wire bonding is a method designed to form physical and electrical contact and it is used to connect integrated circuits (IC) to microsystems (MEMS) and the surrounding housing. The MEMS sensors used in this work were components used for motion detection, much used in the automotive industry. The design of the capillary was changed because the life cycle of the current capillary was quite short, and the size of the wire bond had to be reduced as well.
MEMS sensors, manufactured by Murata Electronics Oy, are used in automotive airbag systems, electronic stability control systems (ESC) and anti-lock braking systems (ABS). These systems are very safety critical, and require high-level quality control. Manufacturing is regulated by several different standards, but the key standards for wire bonding are MIL-STD-883 and AEC-Q100-001. These define the ways in which reliability tests must be performed, as well as determine acceptable limits for results. In addition to this, the formation of an intermetallic compound (IMC) was studied here, and an electrical scanning microscope (SEM) was used to check the shape of bonds. The coordinate measuring machine (CMM) was used to measure the place and size of the bonds.
This thesis consisted of designing a new capillary, testing the reliability of the wire bonds made with the new capillary and analyzing the results. Quality control test results were all acceptable and found here were no deficiencies found. Issues identified with the current capillary in the process were eliminated with the new capillary.
MEMS sensors, manufactured by Murata Electronics Oy, are used in automotive airbag systems, electronic stability control systems (ESC) and anti-lock braking systems (ABS). These systems are very safety critical, and require high-level quality control. Manufacturing is regulated by several different standards, but the key standards for wire bonding are MIL-STD-883 and AEC-Q100-001. These define the ways in which reliability tests must be performed, as well as determine acceptable limits for results. In addition to this, the formation of an intermetallic compound (IMC) was studied here, and an electrical scanning microscope (SEM) was used to check the shape of bonds. The coordinate measuring machine (CMM) was used to measure the place and size of the bonds.
This thesis consisted of designing a new capillary, testing the reliability of the wire bonds made with the new capillary and analyzing the results. Quality control test results were all acceptable and found here were no deficiencies found. Issues identified with the current capillary in the process were eliminated with the new capillary.