VIA Connection : An alternative way for the functional printed film connection

Abstract

In the recent years, printed electronics has gained more and more importance for the possibility to create smaller, thinner and lighter structures implementing new or improved functionalities. In the printed electronics world, an important role is played by the in-mold structural electronics (IMSE) by Tactotek. This technology is able to integrate and encapsulate printed electronics and standard electronic components within durable 3D injection-molded plastics. One of the main challenges in IMSE is represented by the interconnection in between the functional film (called B-Film in the IMSE structure in order to differentiate it from the aesthetic A-Film) and the control unit. There are two different methods widely in use in the recent years:

- FPC connection; - Connection through metal and rigid connectors.

Both of these methodologies are steady and well consolidated and both have pros and cons to be considered when developing a new product and its final use. One of the common disadvantages of these methods is represented by the difficulties in the process and in the tools necessary to get one part ready to use. For this reason, the goal of the thesis is to investigate the possibilities to have an alternative and easier way to get the functional printed film connection. The method that will be taken into account in this thesis is called VIA connection.