Performance analysis of printed electronics under tension stress: evaluating ink and base material compatibility for stretching applications
Kymäläinen, Joni (2023)
2023
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https://urn.fi/URN:NBN:fi:amk-2023082424917
https://urn.fi/URN:NBN:fi:amk-2023082424917
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This study investigates the behaviour of printed electronics under tension stress, focusing on the limits and performance of different ink and base material combinations. Materials samples were created using screen printing as manufacturing method. The research involved conducting stretching tests on sample pieces using a tension stress testing equipment and collecting the data during the tests. The study examined the effects of stress on various properties including force, travel, recovery, resistance, and the overload point.
The results revealed differences in the performance of ink and base material combinations. Two different inks were used together with two different base materials. Inkron IPC-605X ink paired together with Platilon UO73 material demonstrated the most reliable performance with no overload occurrences and a high recovery rate. Asahi LS-411AW ink also exhibited better performance when combined with the Elastollan SP806 material. These findings emphasize the importance of carefully selecting ink and base material combinations in printed electronics applications.
The study highlighted the challenges of incorporating flexibility and stretchability into electronic materials and the need for further research and development to enhance their stability and performance. It also emphasized the potential of printed electronics stress sensors in various industries, where they can be integrated into materials subjected to tension stress.
While the study had limitations in terms of sample size and structural design, it provided valuable insights into the behaviour of printed electronics under tension stress. Future research should consider larger sample sizes, different structural designs, and factors like the number of cycles and rotations in the testing process.
Overall, this research contributes to our understanding of the limits and performance characteristics of printed electronics under tension stress. It provides valuable information for the development and application of flexible and stretchable materials in various applications.
The results revealed differences in the performance of ink and base material combinations. Two different inks were used together with two different base materials. Inkron IPC-605X ink paired together with Platilon UO73 material demonstrated the most reliable performance with no overload occurrences and a high recovery rate. Asahi LS-411AW ink also exhibited better performance when combined with the Elastollan SP806 material. These findings emphasize the importance of carefully selecting ink and base material combinations in printed electronics applications.
The study highlighted the challenges of incorporating flexibility and stretchability into electronic materials and the need for further research and development to enhance their stability and performance. It also emphasized the potential of printed electronics stress sensors in various industries, where they can be integrated into materials subjected to tension stress.
While the study had limitations in terms of sample size and structural design, it provided valuable insights into the behaviour of printed electronics under tension stress. Future research should consider larger sample sizes, different structural designs, and factors like the number of cycles and rotations in the testing process.
Overall, this research contributes to our understanding of the limits and performance characteristics of printed electronics under tension stress. It provides valuable information for the development and application of flexible and stretchable materials in various applications.