Reliability Assessment of Millimetre Wave Components for Space Applications
Levo, Jarmo (2014)
Avaa tiedosto
Lataukset:
Metropolia Ammattikorkeakoulu
2014
All rights reserved
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi:amk-2014111915987
https://urn.fi/URN:NBN:fi:amk-2014111915987
Tiivistelmä
This thesis was aimed at the objective of designing and producing reliability measurement for millimetre wave components that are designed for high frequencies. The components are designed to function in frequency levels from 70 GHz to 100 GHz. In the design parameters it was taken into consideration that the components may be used in space appli-cations.
The project highlight was testing whether MilliLab – VTT has the capability to run reliability measurements fluently. The first chapters will go through various technologies involved with components under measurements. Next the specific theoretical background is introduced that effect reliability. The theory of radio frequency measurements is also introduced.
The test setup was custom designed for this specific project to introduce the basic idea behind running a reliability measurement. Test was combined with using both a temperature step stress and burn-in reliability testing method. The sample size was small with only one chip being tested so the mathematical analysis behind analysing the probability of an error was disregarded. The test structure was successful and efficient producing results.
The conclusion of this thesis was that reliability measurement with the setup in this thesis was successful and MilliLab – VTT has sufficient capability to run a reliability measurement.
The project highlight was testing whether MilliLab – VTT has the capability to run reliability measurements fluently. The first chapters will go through various technologies involved with components under measurements. Next the specific theoretical background is introduced that effect reliability. The theory of radio frequency measurements is also introduced.
The test setup was custom designed for this specific project to introduce the basic idea behind running a reliability measurement. Test was combined with using both a temperature step stress and burn-in reliability testing method. The sample size was small with only one chip being tested so the mathematical analysis behind analysing the probability of an error was disregarded. The test structure was successful and efficient producing results.
The conclusion of this thesis was that reliability measurement with the setup in this thesis was successful and MilliLab – VTT has sufficient capability to run a reliability measurement.